【摘要】 用化学合成法制备用于电子封装中的聚酰亚胺基复合介电材料,并通过透射电镜、红外光谱仪对复合薄膜材料组织观察、结构表征。结果表明,聚酰亚胺基复合材料实际是一种共聚物,属于分子杂化复合材料,是纳米碳化硅小分子均匀分散在大分子聚合物基体中的复合材料体系,介电常数较低,平均值为ε=2．3,最低迭ε=2．0,吸水性也较低。更多还原

【Abstract】 Polyimide dielectric composite used for electron packaging is prepared by chemical synthesis, and the microstructure and structure of polyimide composite is characterized by TEM and infrared spectrometer. The results show that polyimide matrix composite is actually a copolymer, which belongs to molecule miscellaneous composite, and the nanometer SiC monomer is uniformly dispersed into polymer with big molecule., The dielectric constant is low, its average value is 2.3, the minimum can be to 2.0, and the water absorption is low as well.更多还原