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喷射成形电子封装Si-Al合金凝固过程模拟研究
Simulation of Solidification Behavior in Spray-deposited Si-Al Preforms Used for Electronic Packaging Materials
【摘要】 为了优化喷射成形Si-Al合金成形工艺,获得优良的显微组织,本文模拟了喷射成形Si-30wt%Al合金的凝固过程,研究了雾化压力和沉积距离对熔滴冷却过程中的温度和固相分数的影响。模拟计算结果表明,部分优化的工艺参数为:雾化压力0.8 MPa,沉积距离600 mm。该工艺条件下,固相分数可达70%。实验证实,采用该工艺参数易于获得均匀、细小的Si颗粒组织。
【Abstract】 To optimize the spray forming process and obtain desired Si-Al perform microstructures,it is essential to make a full understanding of the solidification process of the alloys.In this study,a numerical simulation of solidification behavior for spray-deposited Si-30wt%Al performs has been calculated and discussed.The 0.8MPa atomization pressure and 600mm axial distance are showed the partly optimized parameters and the solid fraction is more than 7%,and under this parameter condition uniform and tiny si particle organizations can be got.
【Key words】 Spray forming; Electronic packaging; Si-Al alloys; Solidification analysis;
- 【文献出处】 铸造技术 ,Foundry Technology , 编辑部邮箱 ,2007年03期
- 【分类号】TG27
- 【被引频次】5
- 【下载频次】165