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聚氨酯改性TDE-85/MeTHPA体系的固化反应
Curing reaction of TDE-85/MeTHPA resin modified by polyurethane
【摘要】 采用聚氨酯预聚体、扩链剂和交联剂对TDE-85/甲基四氢邻苯二甲酸酐(MeTHPA)树脂进行改性,通过红外光谱和示差扫描量热法(DSC)分析,探讨聚氨酯(PU)改性TDE-85/MeTHPA树脂体系固化反应。研究表明:固化反应的表观活化能由TDE-85/MeTHPA树脂体系的83.14 kJ/mol降至PU改性TDE-85/MeTHPA树脂体系的67.91 kJ/mol。确定的PU改性TDE-85/MeTHPA树脂体系合适的固化工艺条件为:120℃,2 h+140℃,2 h+160℃,2 h。在该固化工艺制度条件下,PU改性TDE-85/MeTHPA体系固化反应完全,能满足固化工艺要求。
【Abstract】 The TDE-85/MeTHPA resin was modified by chain-extended reagent,crosslink agent and polyurethane prepolymer.The curing reaction of the TDE-85/MeTHPA resin modified by polyurethane was discussed by DSC and FT-IR.The results show that the apparent activation energy of the curing reaction is reduced from 83.14 kJ/mol for the TDE-85/ MeTHPA system to 67.91 kJ/mol for the PU modified TDE-85/MeTHPA system.The appropriate curing technology of TDE-85/MeTHPA resin modified by polyurethane is determined as 120 ℃,2 h+140 ℃,2 h+160 ℃,2 h.The TDE-85/MeTHPA resin is modified by polyurethane cures perfectly under this curing condition.
【Key words】 polyurethane; epoxy resin; interpenetrating polymer network; curing reaction;
- 【文献出处】 中南大学学报(自然科学版) ,Journal of Central South University(Science and Technology) , 编辑部邮箱 ,2007年02期
- 【分类号】O631.5
- 【被引频次】6
- 【下载频次】164