【摘要】 针对恶劣环境和严格空间体积限制条件下的多参数测量问题,利用绝缘体上硅(SOI)材料,采用微型机械电子系统(MEMS)技术,研制了一种可以同时测量三轴加速度、绝对压力、温度参数的单片集成硅微传感器,其中加速度、绝对压力传感器基于掺杂硅压阻效应,温度传感器基于掺杂硅电阻温度效应。结合芯片中各传感器的工作原理,用有限元方法对设计的结构进行了仿真,确定集成传感器的电阻分布和结构参数。根据确定的集成传感器结构,制定了相应的制备工艺步骤。最后给出了集成传感器芯片的性能测试结果。更多还原

【Abstract】 A monolithic silicon multi-sensor for use in harsh environment is presented in this paper.This monolithic multi-sensor is fabricated with SOI wafer,which consists of a three-axis piezoresistive accelerometer,a piezoresistive absolute pressure sensor and a silicon thermistor temperature sensor.The designed structures of the multi-sensor are simulated by FEM(finite-element method).The simulation results for the multi-sensor are utilized to determine the position of piezoresistor and the size of the structures.The fabricating process of the monolithic multi-sensor is described,which uses bulk-micromachining technology and silicon-on-glass anodic bonding technology.At last the measurement results of the multi-sensor are shown.更多还原