【摘要】 在进行无钯活化预处理后,对高体积分数SiCp/Al进行化学镀镍,研究了温度和pH值对镀层和沉积速度的影响。采用SEM观察镀层形貌,通过EDX测定镀层的镍磷含量,并用XRD分析了镀层的显微结构。结果表明:在特殊预处理后,采用化学镀镍,可在高体积分数SiCp/Al表面沉积上致密、均匀、结合牢固的镍镀层,镀层为微晶结构,属于中磷镀层。更多还原

【Abstract】 The high volume fraction SiCp/Al is processed by electroless nickel plating after activation without palladium.The influences of temperature and pH on plating rate and plating conditions are studied.The coating morphology is observed by SEM. The contents of nickel and phosphorus on the coating are measured by EDX.The microstructure of coating is analyzed by XRD. The results show that a compacting,uniform and tight bonded Ni-P coating is formed on the surface of SiCp/Al by electroless nickel plating after special pretreatment.The microstructure of the coating is microcrystal,belonging to medium phosphorous coating.更多还原