【摘要】 综述目前比较前沿的几种牺牲层技术的最新进展,简要阐述硅基牺牲层、光刻胶牺牲层、沉积锌牺牲层以及锗化硅(SiGe)牺牲层技术的基本原理和研究现状;同时对这些牺牲层技术的发展趋势以及应用前景进行展望,指出牺牲层技术是微机电系统推广和应用的关键性问题之一。更多还原

【Abstract】 The latest progress of some sacrificial layer technologies is summarized,explains the basic principle and current status of Si-based sacrificial layer、photoresist sacrificial layer、aggradation Zn as sacrificial layer and SiGe-based sacrificial layer;Furthermore,the development tendency of these technologies is discussed,and it is pointed out that the sacrificial layer technology is one of the key problems for the application of MEMS.更多还原