【摘要】 针对金属互连系统上的热点将对集成电路芯片的性能和可靠性产生重大的影响,详细讨论了ULSI金属互连系统上的热点位置和温度分布模型,并通过该模型比较了不同通孔直径和高度情况下,金属互连系统上的热点位置和温度的差别。结果表明,通孔直径和高度对金属互连系统上的热点有重大的影响。更多还原

【Abstract】 Hot spot is one of the most important factors to the performance and reliability of ULSI。An analytical thermal model for estimating the positions and temperatures of hot spot in interconnect and via systems is presented, and comparing the positions and temperatures of hot spots in different via diameters and via heights in the paper. It has been shown that via diameter and via height have important effects on the hot spot of interconnect and via systems.更多还原