【摘要】 采用电弧熔炼(CA)和机械合金化(MA)方法制备了不同显微组织的二元单相Cu-Si合金(CACu-0.15Si和MACu-0.15Si,CACu-1.3Si和MACu-1.3Si),并研究了它们在700℃和800℃纯O2中的高温氧化行为。结果表明,两种方法制备的Cu-Si合金氧化后均形成了富SiO2的混合氧化区,但未形成连续的SiO2保护膜。两种成分的机械合金化Cu-Si合金的氧化速度均小于相同温度下同成分的熔炼Cu-Si合金,这是因为细晶材料及其氧化生成的氧化膜中包含了更多的晶界,为合金各元素及氧的扩散提供了更多的短路扩散通道,使它们扩散速度均有明显提高,SiO2富集区(Cu2O+SiO2)的快速形成有效地限制了Cu的快速向外扩散。更多还原

【Abstract】 The high temperature oxidation behavior of Cu-Si alloy prepared by CA (chemical alloying) and MA(mechanical alloying) was examined in pure O2 at 700~800 ℃. The results show that the mixed oxidation zone with enriched SiO2 can be created, however,the continuum SiO2 film can not be observed in the alloy prepared by both CA and MA methods. The oxidation rate of Cu-Si alloy prepared by MA method is lower than that prepared by CA method, which is attributed to the refinement of grain size in the alloy enhancing the diffusivity of Si. In addition, the rapid formation of SiO2 enriched zone (Cu2O+ SiO2) can effectively control the diffusion of the Cu element.更多还原