【摘要】 无铅钎料和铜基板间金属间化合物(Intermetallic Compounds,IMC)的生长对元器件的可靠性有重要影响.使用Sn3.8Ag0.7Cu无铅钎料焊接Cu对接接头,并对对接头进行了125、150和175℃时效试验,时效时间分别为0、24、72、144、256、400 h.采用金相显微镜、扫描电镜(SEM)和能谱X射线(EDX)观察了Sn3.8Ag0.7Cu/Cu界面IMC的生长及形貌变化,并对Sn3.8Ag0.7Cu/Cu界面扩散常数和生长激活能进行了拟合.此外,研究了时效对钎焊接头抗拉强度的影响,发现在时效条件下接头的抗拉强度呈先上升后下降的变化,且时效会对断裂形式造成影响.更多还原

【Abstract】 The intermetallic compounds(IMC) growth between lead-free solder and Cu pad has an important influence on the primary device reliability.Cu butt joints were welded by Sn3.8Ag(0.7Cu) lead-free solder,and the joints were aged at 125,150 and 175 ℃,aging time is 0,24,72,144,256 and 400 h.The growth and morphological characteristics of the IMCs were investigated by means of optical microscope,SEM and EDX.The diffusion constant and active energy of the IMCs were fitted by experimental data.The relationship between aging and the tensile strength of butt joints was also researched.During the process of aging the tensile strength enhances at first and then degrades.Aging could influence the form of fracture.更多还原