【摘要】 分析了半导体照明高功率白光LED灯串采用InGaN(蓝)/YAG荧光粉将芯片倒装结构,以提高发光效率和散热效果,从白光LED灯串的材料构成,电流/温度/光通量关系得出在倒装芯片的蓝宝石衬底部分(Sapphire)与环氧树脂导光结合面上加上一层硅胶材料以改善芯片出光的折射率。经过光学封装技术的改善,可以大幅度地提高大功率LED灯串的出光率(光通量)。更多还原

【Abstract】 By analyzing the flip chip structure of high power InGaN blue +YAG fluorescence powders white light emitting diode(LED),it shows that it can improve the luminous and heat dissipation efficacy.And by analyzing the composing of white LED and relations between current,temperature and luminous flux,refractive index are improved the interface between the sapphire underlay and epoxy resin by gelatinizing a layer silica gel.By improving the optical encapsulation,the luminous flux of LED can be improved greatly.更多还原