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纯钽片晶粒大小控制与深冲性能
Deep-drawn Performance and Control of Grain Size of the Pure Tantalum Sheet
【摘要】 采用粉末冶金与电子束熔炼法制备纯钽锭坯,坯料经过锻造、轧制成0.3 mm板材,测定了2种方法制备的纯钽的再结晶温度,研究了不同再结晶退火工艺对晶粒大小及其深冲性能的影响。结果表明,粉末冶金法制备的纯钽片的再结晶温度为1200℃,电子束熔炼的纯钽片的再结晶温度为800~900℃。2种钽片分别采用不同的退火工艺都可获得50~100μm的晶粒,其深冲件的表面质量良好。
【Abstract】 The powder metallurgy and electron-beam melting methods were used to prepare tantalum blanks.Tantalum sheets with a thickness of 0.3 mm were produced through forging and rolling of the as-obtained blanks.The recrystallization temperatures of the two kinds of pure tantalum were measured and the effects of the different recrystallized annealing process on the grain size and deep-drawn performance was studied.The results show that the recrystallization temperature of the powder metallurgic tantalum sheets is 1200 ℃,and the electron-beam melting tantalum sheets is ranged from 800 ℃ to 900 ℃.The grain size of 50~100 μm can be achieved by the two methods if different annealing process was used,and the surface quality of the deep-drawn parts are fine.
【Key words】 pure tantalum; recrystallization temperature; grain size; deep-drawn performance;
- 【文献出处】 矿冶工程 ,Mining and Metallurgical Engineering , 编辑部邮箱 ,2007年02期
- 【分类号】TG386
- 【被引频次】9
- 【下载频次】206