【摘要】 低温共烧陶瓷(LTCC)技术目前正逐渐走向成熟,并成为电子封装领域研究的热点。它在高可靠性、高密度方面具有其它组装技术无可比拟的优势。LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。从实现共烧陶瓷低温烧结的途径、陶瓷粉体合成以及流延工艺三个方面探讨了LTCC的技术进展情况。更多还原

【Abstract】 With technology of low temperature co-fired ceramic going mature gradually,it evolves to investigative hot spot in the field of electronic packaging.The technology has unexampled predominance comparing with oth- er packaging technologies about aspect of high reliability and high density.Realization and progression of LTCC depends on two key joints of flow casting and low temperature co-fired ceramic in great degree.The paper summarizes the development of LTCC technique from three aspects,which are the implementation track of the co-fired ceramic low-temperature sintering,the synthesis of ceramic powder and the engineering of low casting. Also,the paper has viewed the future of it through the present researches.更多还原