【摘要】 为提高高体积分数AlNp/Cu复合材料的致密度,采用粉末冶金液相烧结工艺制备了含10vol%Al的AlNp/Cu复合材料,与未添加Al的AlNp/Cu复合材料以及AlN颗粒表面镀铜的AlNp/Cu复合材料进行了组织与热性能的比较。X射线衍射与显微组织观察表明,添加的Al在烧结过程中扩散至铜基体形成固溶体,并能有效的提高AlNp/Cu复合材料的致密度,添加10vol%Al的复合材料相对密度与未添加Al的AlNp/Cu复合材料相比提高了3.5%。热膨胀试验表明:50~550℃之间,40%AlNp/Cu复合材料、添加10vol%Al的40%AlNp/Cu复合材料及AlN颗粒表面镀铜的40%AlNp/Cu复合材料的平均热膨胀系数分别为15.7、13.4和13.4,热循环后的残余应变分别为0.51%、0.18%和0.24%。Al的添加及AlN颗粒表面镀铜都能有效地降低AlNp/Cu复合材料的热膨胀系数和热循环后的残余应变。与表面镀铜的AlNp/Cu复合材料相比,Al的添加在一定程度上降低了AlNp/Cu复合材料的热传导性能,但材料的制备成本显著降低。更多还原

【Abstract】 For improving the relative density of high volume fraction AlN_p/Cu composite,10vol% pure Al were added to prepare AlN_p/Cu composite by liquid sintering powder metallurgy technology.The microstructure and thermal expansion behavior of the composite were compared with AlN_p/Cu composite without addition of Al and copper-coated AlN_p/Cu composite.The results of X ray diffraction and microstructure observing indicate that the additional pure Al diffuses into copper matrix during sinteing and forms solid solution,the relative density of the AlN_p/Cu composite is improved 3.5 percent compared with that of AlN_p/Cu composite without addition of Al.The results of thermal expansion experiment indicate that the average thermal expansion coefficients in the temperature range of 50℃ to 550℃ are 15.7,13.4 and 13.4,and the residual strain is 0.51%,0.18% and 0.24% for the AlN_p/Cu,AlN_p/Cu with addition of Al and copper-coated AlN_p/Cu composites,respectively.The addition of pure Al and copper coated AlN_p all can improve the relative density and decrease the thermal expansion coefficient and residual strain of AlN_p/Cu composites.The addition of pure Al decrease the thermal conductivity of AlN_p/Cu composite at some extents,but the fabrication cost decreases obviously compared with the copper-coated AlN_p/Cu composite.更多还原