【摘要】 以20~40μm无定形硅胶为载体,与十八烷基三氯硅烷进行键合制备了C18反相硅胶键合相。热重差热分析表明所得键合相230℃以下热稳定性良好,对残留硅羟基的定量测定表明采用三甲基氯硅烷进行封端反应可消除3/4以上的残留硅羟基,柱层析试验表明该键合相具有良好的分离效果。更多还原

【Abstract】 The chlorosilane-bonded silica packing was prepared through the reaction of octadecyltrichlorosilane with amorphous silica（20～40 μm）.Differential thermal analysis-thermal gravity analysis（TG-DTA） was employed to characterize the properties of the product.The result showed that the organic layer had a good thermal stability at 230 ℃.More than 3/4 of the residual hydroxyl groups were eliminated after the capping reaction with Me₃SiCl.Results from column chromatography test showed that the C₁₈ bonded silica packing had good separating capability.更多还原