【摘要】 本文对焊点材料为Sn3.8Ag0.7Cu的PBGA封装器件进行了3-维有限元数值模拟.以Aand统一粘塑性本构方程描述无铅焊点的粘塑性行为,研究了在温度循环载荷下焊点阵列等效应力和塑性应变的分布规律,找出了实体模型中最大应力和应变的焊点位置;分析了最大应变焊点的等效应力周期性变化和等效塑性应变累积的动特性曲线;基于Manson-Coffin焊点疲劳寿命模型,对关键焊点进行了寿命预测,疲劳寿命值为3.851×103循环周期.更多还原

【Abstract】 In this paper,three-dimensional finite element model of PBGA package is used to be simulated,lead-free solder Sn3.8Ag0.7Cu was used as the material of solder joints of PBGA.The Anand constitutive was applied to represent the viscoplastic behavior of lead-free solder joints.Distribution of equivalent stress and plastic strain for solder joints array under temperature cycle was studied and located the maximum stress and strain solder joints respectively;The dynamic curve of equivalent stress and plastic strain accumulation of the maximum strain solder joint were analyzed;Based on Manson-Coffin model for life prediction of solder joint,the fatigue life of key solder joint was predicted,the value of fatigue life being 3.851×103 cycles.更多还原