【摘要】 由于无铅焊料的应用,无铅焊点的可靠性问题得到了关注。本文针对无铅焊点的空调器印刷电路板(PCB),结合实际使用条件,采用加速寿命的方式,测试了焊点的寿命。并针对温度循环条件下的焊点,使用有限元模拟技术计算测定了其寿命,并与实验的结果进行了比较,取得了较吻合的结果。更多还原

【Abstract】 As the application of lead-free solder,the reliability of solder joint causes attention. Against lead-free solder joint of air-conditioner PCB,the life of solder joint is test and measure- ment according to speeding up life way based use condition. FEM is applied to calculate the life of solder joint under the con- dition of thermal recycle.The result of FEM is similar to the test.更多还原