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改善建筑陶瓷墙地砖强度和导热性能的试验研究

Experimental Study on Improving the Mechanical and Thermal Properties of Ceramic Title

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【作者】 李清涛吴清仁孙创奇谢代义

【Author】 LI Qing-tao1,WU Qing-ren1,2,SUN Chuang-qi1,XIE Dai-yi1(1.Department of Inorganic Materials,South China University of Technology,Guangzhou 510640,China;2.Key Laboratory of Specially Functional Materials and Advanced Manufacturing Technology(South China University of Technology),Ministry of Education,Guangzhou 510640,China)

【机构】 华南理工大学材料科学与工程学院华南理工大学材料科学与工程学院 广州510640广州510640华南理工大学特种功能材料及其制备新技术教育部重点实验室广州510640

【摘要】 以粘土、煅烧高岭土、长石、锂辉石和煅烧氧化铝等为原料,采用半干压法压制成型,在1210~1220℃温度范围内烧成,研制了具有较高体积密度、抗压强度和导热系数的新型陶瓷墙地砖。实验研究结果表明,通过优化现有陶瓷墙地砖的工艺配方,改善陶瓷墙地砖微观结构,有利于降低陶瓷墙地砖的气孔率,提高陶瓷墙地砖的致密度和刚玉-莫来石相含量,可获得导热系数为2.0~2.4W/(m.K)、断裂模数为51~57MPa的新型陶瓷墙地砖。

【Abstract】 Based on the raw materials of clay,calcined Kaolin,feldspar,spodumene and claimed alumina,molded by semidry molding and fired in the temperature range from 1210℃ to 1220℃,the new ceramic tile with higher bulk density,compressive strength and thermal conductivity has been manufactured.The experimental results show that the microstructure of the new ceramic tile can be improved by mending the present formula,decreasing the percentage of voids and increasing the corundum/mollite,and that the bulk density,compressive strength and thermal conductivity can be promoted.The new ceramic tile with the thermal conductivity 2.0-2.4 W/(m·K)and the fracture modulus 51-57 MPa were fabricated.

【基金】 广东省自然科学基金项目(No.011552);广东省科技计划重点项目(2005A30301001);广州科技计划重点项目(2004C13G0231)
  • 【文献出处】 硅酸盐通报 ,Bulletin of the Chinese Ceramic Society , 编辑部邮箱 ,2007年02期
  • 【分类号】TQ174
  • 【被引频次】2
  • 【下载频次】324
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