【摘要】 通过扫描电镜分析,研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化,讨论了烧结过程中对膜层致密度的影响因素。结果表明,烧结温度、烧结制度显著影响膜层微观结构,膜层中出现的针眼状孔洞主要是有机成分挥发、铂粉和玻璃体的拉聚收缩及冷却过程中基体对膜层拉附作用的综合结果。更多还原

【Abstract】 Changes of microstructure of the thick film platinum resistance paste during drying and sintering were studied by SEM.The main factors influencing tightness of the sintered membrane were discussed.The results indicated that the sintering temperature and schedule influence the microstructure of the sintered membrane significantly.The pinhole in the platinum film is attributed to the synthetical effects of the volatilization of organic component,the shrinkage of platinum and glass powder and the drawing force from the substrate during cooling procedure.更多还原