【摘要】 首先提出射频反应磁控溅射中薄膜沉积速率同O2流量和溅射功率关系的理论计算模型;其次根据这一理论计算模型,在O2/Ar气氛中,利用射频反应磁控溅射制备氧化铁镍薄膜;最后分别采用台阶仪、X射线衍射(XRD)、X射线光电子能谱(XPS)、电子扫描镜(SEM)和电化学工作站对薄膜进行了表征,并分析了在制备过程中O2含量、工作压强和溅射功率对薄膜的沉积速率、结构、组分和表面形貌的影响。实验验证了所提出的理论计算模型以及Ni3+的存在;得到了膜厚与晶型以及工作压强与形貌的关系;电化学测试结果为:在电流密度为8 mA/cm2时的过电势为284 mV。更多还原

【Abstract】 The theoretical calculation model of relation between film deposition rate and flux of oxygen and RF power about RF reactive magnetron sputtering was advanced;Then,the films were prepared by RF reactive magnetron sputtering in an oxygen and argon atmosphere based on the theoretical calculation model and the requirement of hydrogen production from solar energy;Finally,the films were characterized by stylus surface-roughness detector,XRD,XPS and SEM and the effects of sputtering parameters(oxygen content,working pressure,RF power) on the deposition rate,structure,composition and surface morphology were analyzed.The theoretical calculation model and the existence of Ni3+ were certified in experiments.The relations of structure and thickness fo films,working pressure and surface morphology were obtained.The overpotential is 284 mV at 8 mA/cm2.更多还原