【摘要】 以Cu粉和Cr2Nb粉为原材料,分别采用真空烧结和真空热压工艺制备新型Cu/Cr2Nb触头材料。研究了制备工艺、材料成分对Cu/Cr2Nb触头材料的组织和性能的影响规律。结果表明,采用一般烧结工艺难以制备出致密度高的Cu/Cr2Nb材料,而采用热压工艺不仅可制备出致密度高的Cu/Cr2Nb材料,而且与CuCr50触头材料相比,在硬度相当的前提下,Cu/Cr2Nb材料的导电性能显著提高。更多还原

【Abstract】 The new-type Cu/Cr2Nb contact materials were fabricated from the mixture of Cu and Cr2Nb powders by the vacuum sintering and hot-pressing, respectively. The effects of fabrication processes and composition on the microstructures and properties were investigated. The results show that the Cu/Cr2Nb materials with high relative density are difficult to be obtained by the pressureless sintering, the Cu/Cr2Nb materials with high relative density can be fabricated by hot-pressing, compared with CuCr50 contact materials, the conductive behaviours of the hot-pressed Cu/Cr2Nb materials are greatly improved under the condition of the hardness of both materials being comparable.更多还原