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大功率电子器件散热系统的数值模拟

Numerical Simulation on the Heat Sink for High-Power Semiconductor

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【作者】 刘衍平高新霞

【Author】 LIU Yan-ping,GAO Xin-xia(Key of Condition Monitoring and Control for Power Plant Equipment of Ministry of Education,North China Electric Power University,Beijing 102206,China)

【机构】 华北电力大学电站设备状态监测与控制教育部重点实验室华北电力大学电站设备状态监测与控制教育部重点实验室 北京102206北京102206

【摘要】 针对大功率器件的散热状况,采用强迫水冷的散热系统设计方案,并依据国家有关标准与试验要求,应用有限元分析软件ANSYS对其水冷散热器的流场、温度场进行了数值模拟和系统分析.模拟结果不仅可以方便地观察到散热器内腔各处水流的饱和程度、流速及压力分布,而且可以得到功率器件、散热器和流体的温度分布;同时也验证了数值模拟方法的合理性,对散热器结构的优化设计提供了可靠的保证.

【Abstract】 With the heat flow condition of high-power semiconductor,this paper presents a new concept using forced water cooling,and the performance of the water-cooling heat sink is analyzed by using ANSYS software of the finite element analysis based on the State standards and test requirements.As a result of the numerical simulation,not only saturated degree of the water flow,velocity or pressure but the temperature distribution of power semiconductor,heat sink and fluid may be achieved.In summing up it may be stated that the simulation method has been proved to be rational,which contributes to the optimal design of heat sink structure.

  • 【文献出处】 电子器件 ,Chinese Journal of Electron Devices , 编辑部邮箱 ,2007年02期
  • 【分类号】TN603
  • 【被引频次】42
  • 【下载频次】679
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