【摘要】 陶瓷与金属的连接是电子产品生产的关键环节。由于陶瓷和金属的物化、力学性能上存在巨大差异,对连接技术要求非常苛刻。通过对陶瓷与金属的常用连接方法的比较分析,提出了一种绿色活性电子器件封接技术,该技术能够在空气中不使用任何焊剂连接陶瓷与金属以及其他非金属组合,具有广泛的应用前景。通过对陶瓷与金属封接接头的力学测试和微观观察发现,接头剪切强度超过30MPa,连接界面良好;表明形成了性能和质量优良的钎焊接头。更多还原

【Abstract】 The bonding of ceramic and metal is the key link in electronic products manufacturing.The physic-chemical and mechanical properties of ceramic and metal are quite different,so they are very difficult to bond together.Based on the comparison and analysis of the normal bonding processes for ceramics and metal,a green active packaging process for electron devices has been introduced.Using this new technology,ceramics with metals or other non-metals combinations can be directly flux-free bonded in air,so that it has a wide application foreground.The mechanical tests and the interface microstructures observations of packaging joint of ceramics with metals have been conducted.The joints shear strengthens are all over 30 MPa,and the good bonding has formed between ceramics and metals.The results indicate that the packaging joints have good quality and property.更多还原