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新型微通道散热器设计仿真

Design and Simulation of a Novel Microchannel Heatsink

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【作者】 王艳丁桂甫张东梅顾东华

【Author】 WANG Yan,DING Gui-fu, ZHANG Dong-mei, GU Dong-hua (National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory of Thin Film and microfabrication of Ministry of Education, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China)

【机构】 上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细加工技术教育部重点实验室上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细加工技术教育部重点实验室 上海200030上海200030

【摘要】 在传统的硅基微通道散热器原理基础上,通过采用高热导率的散热板,以及特殊的变截面微通道阵列,实现微型散热器工作流体的整体稳定流动和短程均匀散热工作模式.采用ANSYS通用有限元分析软件,给出了典型换热单元在参考流速1m/s,温度283K初始状态下的流速场和温度场,散热器可输运5×107W/m2的热通量,总热阻低至0.0106℃/W.仿真结果初步验证了设计构想的合理性,散热器有望拥有良好工作特性.

【Abstract】 Based on the traditional microchannel heat sink, using the heat spreader with high heat conductivity and special microchannel array with variational cross section areas, an entire steady flow model and a short-distance heat transfer model of working fluid was realized. Applying commercial FE software package [ANSYS],the flow velocity distribution and temperature field of the typical heat transfer unit of microchannel heat sink was given with the reference flow rate 1 m/s and the temperature 283 K. The heat flux of 5×10~7W/m~2 can be dissipated and the total thermal resistance is below to 0.0 106℃/W. The simulational result proves the initial design concept and illustrates this microchannel heat sink would have good working performance.

  • 【文献出处】 电子器件 ,Chinese Journal of Electron Devices , 编辑部邮箱 ,2007年01期
  • 【分类号】TK172
  • 【被引频次】12
  • 【下载频次】705
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