【摘要】 无铅焊膏用助焊剂需要一定的黏性,选择有机酸和有机胺混合作为活性物质,配合一定量的松香配制出一种助焊剂。通过控制助焊剂中松香的含量,降低不挥发物的含量,减少残留物对元器件的腐蚀。依据标准对所配制的助焊剂进行了性能测试,并与一种松香含量较高的助焊剂比较。结果表明:助焊剂的松香含量降低约10%,在260℃焊接后不挥发物含量降低了近6%,黏度较好,无卤化物,无毒,环保,符合焊膏用助焊剂的要求。更多还原

【Abstract】 Active agent mixed with organic acid and organic amine were applied to keep good viscosity of flux for lead-free solder paste.In order to reduce the corrosion of components caused by the residue,the amount of rosin was controlled.It reduced significantly the amount of non-volatile matter.The properties of this flux were tested according to the industry standard,and compared with a flux which contains a high amount of rosin.The results show that when the amount of rosin decreased about 10 %,the amount of non-volatile matter reduced by 6 % after 260 ℃ welding,the flux is good viscosity,and it is halogen-free,nontoxic and environmentally friendly,thus it meets the needs of lead-free solder paste.更多还原