【摘要】 研究了微量稀土对Sn-58Bi低温钎料的改性作用。试验添加质量分数为0.1%Ce组混合稀土的无铅材料,并对比Sn-58Bi和Sn-58Bi0.5Ag合金。观察了钎料显微组织的变化并做了定量分析,采用DSC测试了钎料的熔化温度,同时测量了钎料的润湿性能、接头强度与硬度。结果表明,微量稀土添加细化了Sn-58Bi钎料合金的显微组织,对钎料的熔化温度几乎没有影响,能显著改善Sn-58Bi钎料的润湿性能和接头剪切强度,而且改善的程度优于添加微量Ag对Sn-58Bi钎料的作用。更多还原

【Abstract】 The modification of Sn-58Bi low-temperature solder adding a trace amount of rare earths(RE) was studied.The Ce group mixed RE was used.Sn-58Bi and Sn-58Bi0.5Ag were be comparision solders.In the experiments microstructural evolution was observed and then quantitative analysis was conducted.Melt temperature was measured by a DSC.At the same time the wettability of solder and the strength and hardness of solder joint were measured.The test results indicate that microstructure of the Sn-58Bi solder with adding a trace amount of RE are fined.The small amount of RE addition gave no influence on the melt temperature of the solder,but obviously improved the wettability of solder and the shear strength of the solder joint.Moreover,the improved effectiveness for the Sn-58Bi solder adding trace RE is superior to the solder adding a small amount of Ag.更多还原