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片式电阻保护浆料的制备
Preparation of chip resistor protective paste
【摘要】 通过与日本样进行对比试验,研究了片式电阻保护浆料的制备工艺及要求。分析了玻璃组成和浆料配方对元件电阻值漂移的影响,并对其保护机理进行了探讨。制备的浆料达到日本样技术指标的要求。利用4号玻璃组分的1MΩ片电阻的阻值漂移率最小为0.9%
【Abstract】 The chip resistor paste production process and requiring by doing parallel experiment with JP pastes were reseached. Glasses and pastes comprising influence on components resistance fluctuating was studied, and least shift rate of resistance is 0.9 % for 1 MΩ chip resistor with No.4 glass component. The protective mechanism was discussed. The prepared paste accord with JP pastes technical requiring.
【关键词】 电子技术;
保护浆料;
电阻漂移率;
电阻膜;
附着强度;
【Key words】 electron technology; protective paste; resistance fluctuating; resistor film; adhesion strength;
【Key words】 electron technology; protective paste; resistance fluctuating; resistor film; adhesion strength;
【基金】 贵州省科学技术基金资助项目[黔基合计字(2002)3030号]
- 【文献出处】 电子元件与材料 ,Electronic Components and Materials , 编辑部邮箱 ,2007年03期
- 【分类号】TM54
- 【被引频次】1
- 【下载频次】190