【摘要】 对从事微电子封装技术与培训、封装外壳与特种器件封装、封装设备、封装可靠性与标准化、封装材料、测试技术研发的科研院所进行了分析;对高等院校的微电子封装科研及人才培养机构进行了分析,对从事微电子封装研究、开发和服务的其他机构进行了分析。最后对我国封装研发和产业发展能力的培养进行了探讨。更多还原

【Abstract】 This article analysed the academes which engage micro-electronic packaging and breed, packag- ing crust and special apparatus packaging, packaging equipments, packaging dependability and standardization, packaging materials, test technology’s research. Analysed the altitude academys’ foster frameworks of micro- electronic packaging research and persons with ability. Analysed the other frameworks which engage micro- electronic packaging research, empolder and service. And discussed the development ability of packaging re- search and industry in China.更多还原