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柔性电热镍微夹钳结构设计及加工测试研究

Research on design,fabrication and performance testing of compliant electrothermal nickel microgripper

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【作者】 褚金奎郝秀春关乐王立鼎

【Author】 CHU Jin-kui1,2,HAO Xiu-chun1,2,GUAN Le1,2,WANG Li-ding1,2(1.Key Lab.for Precis.& Non-tradit.Mach.Technol.of Minist.of Edu.,Dalian Univ.of Technol., Dalian 116024,China; 2.Key Lab.for Micro/Nano Technol.and Syst.of Liaoning Prov.,Dalian Univ.of Technol., Dalian 116024,China)

【机构】 大连理工大学精密与特种加工教育部重点实验室大连理工大学精密与特种加工教育部重点实验室 辽宁大连116024大连理工大学辽宁省微纳米技术及系统重点实验室辽宁大连116024

【摘要】 把柔性机构的设计方法——伪刚体法应用于柔性微夹钳的设计中,得到一种新结构形式的电热微夹钳,用UV-L IGA方法进行加工制作,并进行动态性能测试.从对称的平面十杆刚性机构得到其伪刚体模型,对伪刚体模型进行优化并柔性化得到放大20倍的柔性微夹钳钳体,通过仿真验证了设计的正确性和可靠性.V形电热驱动器与柔性钳体集成到一起,形成柔性电热微夹钳.用SU-8胶做电铸铸模,钛和二氧化硅做牺牲层,铜做种子层,在氨基磺酸镍电铸液中进行电铸,加工出最小特征尺寸10μm,厚度30μm的电热镍微夹钳.最后对制作的微夹钳在0~1.5 V直流电压下进行动态测试,夹持端位移最大可达24μm.

【Abstract】 Pseudo-rigid-body method which is one of compliant mechanisms design methods was used to design compliant microgripper,and a new electrothermal microgripper was obtained.The electrothermal microgripper was fabricated with UV-LIGA process,as well as simulated and tested.The pseudo-rigid-body model was created from a symmetrical planar 10-bar linkage.The microgripper form was obtained through optimizing the pseudo-rigid-body model and making the hinge flexibility.This part can generate the desired output displacement,and can magnify the input displacement up to 20 times.V-shaped electrothermal actuator was attached to actuate the microgripper.During the UV-LIGA process,titanium layer and silicon dioxide were used as a sacrificial layer,copper layer was used as a seed layer,and UV-LIGA process was performed by nickel electroplating in a nickel-sulfamate-based solution with SU-8 mold.Finally,a smallest feature size of 10 μm,30 μm thick nickel electrothermal microgripper was fabricated.Dynamic performance of the nickel microgripper was tested within 0-1.5 V voltage range.The maximum displacement between two jaws of up to 24 μm was recorded for this nickel microgripper.

【基金】 国家自然科学基金资助项目(50135040,50475153)
  • 【文献出处】 大连理工大学学报 ,Journal of Dalian University of Technology , 编辑部邮箱 ,2007年03期
  • 【分类号】TH703
  • 【被引频次】11
  • 【下载频次】232
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