节点文献
热声焊机在电子封装业中的应用
The Application of Heat Ultrasonic Bonding in the Electronic Package Field
【摘要】 热声焊技术可实现金丝的高质量焊接。介绍了热声焊的原理、焊接材料、工艺、设备,热声焊机已应用于微波器件、组件的制造及其相关工艺的研究。
【Abstract】 Heat ultrasonic bonding technology is a reliable method for gold wires.This paper introduces the theory,bonding material,process,and the equipment of Heat ultrasonic bonding,which has applied to the manufacturing of microwave devices and research of process technology for microwave devices.
- 【文献出处】 电子工业专用设备 ,Equipment for Electronic Products Manufacturing , 编辑部邮箱 ,2007年06期
- 【分类号】TN405
- 【被引频次】7
- 【下载频次】102