【摘要】 综述了化学镀金的研究进展。详细阐述以亚硫酸钠及硫代硫酸钠为配位剂的无氰化学镀金的研究及发展现状。同时介绍了用于印刷线路板(PCB)的置换镀金工艺现状及前景,以期对无氰化学镀金的研究现状及未来发展有更好的了解。更多还原

【Abstract】 The progress in research on non-cyanide electroless gold plating is reviewed. The research and status of non-cyanide electroless gold plating using sodium sulfite and/or hyposulphite as complexing agent are described in detail.The status and prospect of immersion gold plating in PCB are presented as well.The purpose is for a better understanding of the present level and future development of non-cyanide electroless gold plating.更多还原