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电沉积Zn-Sn合金工艺的研究
Electrodeposition of Zn-Sn Alloy
【摘要】 在电解铜箔上采用碱性焦磷酸盐体系电镀Zn-Sn合金,可改善铜箔表面的综合性能。研究了配位剂、pH值、温度、电流密度等对镀层质量的影响,选择了合适的添加剂,并对其极化行为进行了研究,优化确定了电镀Zn-Sn合金的镀液组成和工艺条件。经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能均有明显提高。
【Abstract】 The combination properties of copper foil surface can be improved by electroplating Zn-Sn alloy on it using alkaline pyrophosphate system.Effects of complex agent,pH,temperature,current density on the quality of the coating are investigated;on this basis,an appropriate additive is chosen,and its polarization behavior is also studied,thus the bath composition and process conditions for Zn-Sn alloy electroplating have been optimized.The processed electrolytic copper foil has been obviously improved in corrosion resistance,heat resistance and binding strength.
- 【文献出处】 电镀与环保 ,Electroplating & Pollution Control , 编辑部邮箱 ,2007年02期
- 【分类号】TQ153.2
- 【被引频次】3
- 【下载频次】201