【摘要】 作为一种新兴的集成封装技术,低温共烧陶瓷(LTCC)技术以其优良的高频和高速传输特性、小型化、高可靠而备受关注。介绍了低温共烧陶瓷技术的工艺、材料特性、应用及发展趋势,分析其在功能模块领域应用的可行性。更多还原

【Abstract】 As a new integrating and packing technology, the low temperature co-fired ceramic (LTCC) technology attracts close attention for its excellent high frequency and high speed transfer characteristics, miniaturization, high reliability. In this paper, the technics, material characteristics, application and development trend of LTCC technology are introduced, and its application feasibility in the function module area is analyzed.更多还原