【摘要】 研究了固定的化学镀铜基础配方在表面活性剂与极性有机物作用下的吸收光谱和沉铜速率;探讨了表面活性剂和极性有机物、光谱曲线变化、沉铜速率3者之间的内在联系及相互作用机理。结果表明:加入光谱曲线产生红移的阳离子表面活性剂十六烷基三甲基溴化铵(CTAB)可使镀液的沉铜速率提高,CTAB的添加量为4 mg/L时,沉铜速率可达6.37μm/h;加入光谱曲线产生红移的阴离子表面活性剂十二烷基苯磺酸钠(SDBS)、十二烷基硫酸钠(SDS)和极性有机物甲基磺酸(MSA)、苯磺酸钠(SBS)都对沉铜反应起阻碍作用,沉铜速率表现为SBS<SDBS<SDS<MSA;加入光谱曲线产生蓝移的极性有机物1,4-丁炔二醇(BOZ)使镀液的沉铜速率总体提高,但加入量大小对沉铜速率的影响不明显。更多还原

【Abstract】 The absorption spectrum and copper deposition rate of a given chemical copper plating solution affected by different surfactants and polar organics were investigated.The internal relations and mutual actions among the surfactants,the(absorption) spectrum curve and copper deposition rate were studied.Results showed that,the addition of cationic surfactant,(cetyltrimethylammonium) bromide(CTAB)that causes the red shift of the absorption spectrum will accelerate the copper (deposition) rate.At the dosage of CTAB of 4 mg/L,the copper deposition rate can achieve 6.37 μm/h.However,nevertheless the anionic surfactants sodium dodecyl benzene sulfonate(SDBS)and sodium dodecyl sulfate(SDS)as well as polar(organics) methyl sulfonic acid(MSA)and sodium benzene sulfonate(SBS)will cause the red shift of the absorption spectrum too,the addition of any one of them will hinder the copper deposition.The copper deposition rate performs as SBS<SDBS<SDS<MSA.The addition of polar organic 2-butyne-1,4-diol will cause the blue shift of the absorption spectrum and will generally accelerate the copper deposition rate,but the effect of the magnitude of its concentration on the copper(deposition) rate is not significant.更多还原