节点文献
单片集成的高性能压阻式三轴高g加速度计的设计、制造和测试
Design,Fabrication,and Characterization of a High-Performance Monolithic Triaxial Piezoresistive High-g Accelerometer
【摘要】 设计、制造并测试了一种单片集成的压阻式高性能三轴高g加速度计,量程可达105g.x和y轴单元均采用一种带微梁的三梁-质量块结构,z轴单元采用三梁-双岛结构.与传统的单悬臂梁结构或者悬臂梁-质量块结构相比,这两种结构均同时具有高灵敏度和高谐振频率的优点.采用ANSYS软件进行了结构分析和优化设计.中间结构层主要制作工艺包括压阻集成工艺和双面DeepICP刻蚀,并与玻璃衬底阳极键合和上层盖板BCB键合形成可以塑封的三层结构,从而提高加速度计的可靠性.封装以后的加速度计采用落杆方法进行测试,三轴灵敏度分别为2.28,2.36和2.52μV/g,谐振频率分别为309,302和156kHz.利用东菱冲击试验台,采用比较校准法测得y轴和z轴加速度计的非线性度分别为1.4%和1.8%.
【Abstract】 A silicon machined high-performance monolithic triaxial piezoresistive accelerometer is developed for measurements on the order of 100,000g.A three-beam-mass scheme with tiny beams is developed for the x and y axial elements,and a three-beam-twin-mass structure is developed for the z axial element.Both of these structures feature high sensitivity and high resonance frequency compared with a conventional cantilever structure or cantilever-mass structure.ANSYS is used to analyze and optically design the accelerometer.The three sensing elements are monolithically integrated by micromachining techniques of double-sided deep etching combined with piezoresistive processes.The middle structure silicon layer is anodic bonded with glass substrate and BCB bonded with a top cap silicon layer for the purpose of plastic packaging to improve the reliability of the accelerometer.A dropping-bar system is used to characterize the accelerometer.The sensitivities in the x,y,and z axes are measured to be 2.28,2.36,and 2.52μV/g,respectively,while the corresponding resonant frequencies are 309,302,and 156kHz.Using a Dongling shock test machine,the nonlinearity is tested by comparison calibration and measured to be 1.4% and 1.8% for the y and z axial elements,respectively.
【Key words】 silicon micromachining technology; triaxial accelerometer; piezoresistive; high-g; plastic package;
- 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,2007年09期
- 【分类号】TH824.4
- 【被引频次】19
- 【下载频次】481