【摘要】 提出了一种新型热感功耗模型,该模型能够准确估计出电压调整情况下的功耗和温度.实验结果表明如果忽略热效应,泄漏功耗将会被低估最高达52%.使用电压调整技术对电路的能量消耗和温度进行协同优化时,两者具有不一致的优化方向.温度是未来集成电路发展的一个重要限制因素,而温度优化方法可以降低电路温度最高达12℃,同时其能耗的增长低于最优解的1.8%.更多还原

【Abstract】 We propose a novel thermal-conscious power model for integrated circuits that can accurately predict power and temperature under voltage scaling.Experimental results show that the leakage power consumption is underestimated by 52% if thermal effects are omitted.Furthermore,an inconsistency arises when energy and temperature are simultaneously optimized by dynamic voltage scaling.Temperature is a limiting factor for future integrated circuits,and the thermal optimization approach can attain a temperature reduction of up to 12℃ with less than 1.8% energy penalty compared with the energy optimization one.更多还原