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硅(100)晶面的凸角腐蚀及其补偿
Convex Corner Undercutting and Compensation in Si(100)Wafer
【摘要】 在进行Si(100)台面腐蚀时,由于硅的各向异性腐蚀特性,凸角处呈现严重切削现象。凸角侧向腐蚀程度与腐蚀深度、腐蚀温度、腐蚀剂配比等诸多因素有关。针对方形补偿结构探讨了凸角腐蚀的补偿原理,设计了补偿版图,并在KOH腐蚀液中进行实验验证,获得了与理论分析结果相一致的直角凸面补偿效果。
【Abstract】 The corner undercutting was quite serious because of the anisotropic etching on crystalline Si(100)wafer. It was relative to the etching depths,temperature and the etchant proportion and types. The principle of compensation based on square compensation structure was discussed,and the graphics of compensation was designed and experimented with KOH etchant. The compensation effect of the convex corner accorded well with the theory.
【关键词】 各向异性腐蚀;
凸角补偿;
氢氧化钾腐蚀液;
【Key words】 anisotropic etching; convex corner undercutting compensation; KOH etchant;
【Key words】 anisotropic etching; convex corner undercutting compensation; KOH etchant;
【基金】 国家自然科学基金资助项目(60574092,60174034)
- 【文献出处】 微纳电子技术 ,Micronanoelectronic Technology , 编辑部邮箱 ,2007年02期
- 【分类号】TG172
- 【被引频次】10
- 【下载频次】386