【摘要】 微电子技术和封装工艺的发展使超大规模集成电路(VLSI)的密度越来越高,而高密度低温共烧陶瓷(LTCC)基板的制作依赖于基板内部导体的精细互连技术。为了满足LTCC多层基板高密度互连的工艺要求,必须使基板微通孔的直径及导线线宽缩小到100μm以内。基于此,首先介绍了LTCC生瓷带层的微通孔形成与填充工艺,以及所形成的微通孔的特点;利用厚膜丝网印刷技术形成精细导线,分析了影响印刷质量的工艺参数;最后简要介绍了薄膜光刻等新技术。通过应用上述几种先进的精细互连工艺技术,极大地提高了LTCC多层基板的互连密度。更多还原

【Abstract】 With the development of microelectronics and packaging technologies,VLSI circuit densities increase a lot.The fabrication of high density low temperature co-fired ceramic(LTCC) substrates depends on the fine interconnection technology of the conductor.In order to meet the requirement of high density interconnections of LTCC multilayer substrates,the size of via and line/spacing of the conductor must be reduced under 100 μm.The process of micro-via formation and micro-via fill,and the important characteristic of micro-via were introduced.Then the screen printing technology of fine conductor was discussed,including some process parameters which affected the quality of printing conductor.Finally,some new techniques as photo-imaginable were presented.Exploiting the advanced fine interconnection techniques,the interconnection densities of LTCC multilayer substrates are improved significantly.更多还原