【摘要】 阐述了在无铅转移过程中涉及的可制造性与可靠性问题,包括无铅转移对元器件、印制电路板与焊点的影响以及它们相互之间的兼容问题。重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。更多还原

【Abstract】 The manufacturability and reliability problems involved during the lead-free transfer process and transition stage were discussed, including its influence on the components/devices, PCB and solder alloy and the compatibility problems. The forward compatibility, backward compatibility, tin whisker, voids, micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.更多还原