【摘要】 研究了不同铜含量的Sn-xCu钎料(x=0,0.1%,0.3%,0.7%,0.9%,1.5%)与Cu板和Ni板在260、280和290℃钎焊后界面金属间化合物(IMC)的成分和形貌。研究结果表明:钎料与Cu板钎焊时,钎焊温度越高,界面处形成的Cu6Sn5IMC厚度越大,而在同一钎焊温度下,随着钎料中铜含量的增加,IMC的厚度先减少后增加;与Ni板钎焊时,界面IMC的厚度随着铜含量的增加而增加,同时界面化合物的成分和形貌均发生了显著变化;当Cu含量小于0.3%(质量分数)时,界面处形成了连续的(CuxNi1-x)3Sn4层;而当Cu含量为0.7%时,界面处同时存在着短棒状(CuxNi1-x)3Sn4和大块状(CuxNi1-x)6Sn5IMC;当铜含量继续增大时(0.9%~1.5%),(CuxNi1-x)3Sn4IMC消失,只发现了棒状(CuxNi1-x)6Sn5IMC。讨论了钎料中Cu含量对与Cu、Ni基板钎焊接头界面化合物生长的影响,并进一步讨论了(CuxNi1-x)6Sn5IMC的形成和长大机理。更多还原

【Abstract】 The reactions between Sn-xCu（x=0,0.1%,0.3%,0.7%,0.9%,1.5%） and Cu or Ni at 260,280 and 290℃ were studied to reveal the effect of varying Cu content on the composition and morphologies of intermetallic compounds（IMC） formed at the interface between solders and the substrate.The IMCs formed at the interface of Sn-Cu/Cu are Cu₆Sn₅.The higher the temperature is,the thicker the IMC layer forms.While soldering at the same temperature,with the increase of Cu content the thickness of IMC reduces first then increases.The thickness of IMC increases with the increase of Cu content when soldered with Ni at 260℃. And at the same time,the composition and morphologies of the IMC have notable changes.When the Cu content is below 0.3%（mass fraction）,a continuous(Cu_xNi_1-x)₃Sn₄ IMC layer formed at the interface.When the Cu content is 0.7%,bigger facet(Cu_xNi_1-x)₆Sn₅ IMCs are found on the(Cu_xNi_1-x)₃Sn₄ IMC layer.At higher Cu content（0.9%1.5%）,stick shaped(Cu_xNi_1-x)₆Sn₅ IMCs are detected and(Cu_xNi_1-x)₃Sn₄ IMCs disappear.The effect of Cu content on the growth of IMC layer is analyzed and the formation and growth mechanisms of (Cu_xNi_1-x)₆Sn₅ IMC are discussed further.更多还原