【摘要】 研究了Bi、Ag对Sn-9Zn无铅钎料系统润湿性、接头力学性能及微观组织的影响。结果表明:Sn-9Zn无铅钎料的润湿性较差,添加适量的Bi有助于提高钎料的润湿性和接头剪切强度,但同时也使接头的塑性降低;添加适量的Ag能明显改善钎料的润湿性和接头塑性,但Ag的质量分数超过1.5%时会降低钎料润湿性和接头剪切强度。Sn-9Zn-Bi系无铅钎料组织由富Sn相、富Zn相及Bi的析出物组成;Sn-9Zn-Ag系无铅钎料组织由富Sn相、富Zn相及AgZn3化合物组成。更多还原

【Abstract】 The influences of the addition of Bi,Ag to Sn-9Zn lead-free solder on the microstructure,wettability and mechanical properties were studied.The results show that Sn-9Zn lead-free solder has poor wettability.With the addition of Bi to Sn-9Zn lead-free solder,the improvement of wettability and shearing strength of joint can be（achieved）,but plasticity of joint decreases.With the addition of suitable amount Ag to Sn-9Zn lead-free solder,the improvement of wettability and plasticity of joint can be achieved obviously.With the addition of up to 1.5%Ag（mass fraction） to Sn-9Zn lead-free solder,the wettability and shearing strength of joint decreases.The micro-（structures） of Sn-9Zn-Bi solder system are composed of β-Sn matrix,Zn-rich phase and the precipitation of Bi phase in the β-Sn matrix.The microstructures of Sn-9Zn-Ag solder system are composed of β-Sn matrix,Zn-rich phase and（AgZn₃） intermetallic compound.更多还原