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The jointing stress analysis of one-shot seal-off high-voltage vacuum interrupters

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【Author】 Zhao Zhizhong, Zou Jiyan, Cong Jiyuan, Wen Huabin and Sun Hui, Department of Electrical and Electronic Engineering, Dalian University of Technology, Dalian, 116024.

【机构】 Wen Huabin and Sun Hui Department of Electrical and Electronic Engineering Dalian University of Technology； Wen Huabin and Sun Hui Department of Electrical and Electronic Engineering Dalian University of Technology； Dalian 116024 Dalian 116024 Dalian 116024 Dalian 116024 Dalian 116024；

【Abstract】 The free shrinkage of ceramic or metal is restricted due to solidification of the solder. Hence the shrinkage stress arises and the jointing strength is reduced during the brazing of high-voltage vacuum interrupters (HVVIs). The solder bound contour was gained by solved energy bound equation. The finite element model of weld beads was established with Surface Evolver software. Then the stress in two different cooling techniques (natural cooling and force cooling) was calculated with ANSYS. Comparing the stress, a better cooling technique was selected for HVVIs. Its cooling time is shortened by 3 hours while the jointing stress doesn’t increase and the tensile strength of ceramic to metal seal is not decreased. The stress-rupture tests have validated the calculated results. More important, a method is found, by which the brazing technique could be improved in advance instead of blind experiments.更多还原

【关键词】 high-voltage vacuum interrupters； brazing cooling technique； finite element； jointing stress；
【Key words】 high-voltage vacuum interrupters； brazing cooling technique； finite element； jointing stress；

【基金】 Sponsored by the National Natural Science Foundation of China(50377003).

【文献出处】 China Welding ,中国焊接(英文版) , 编辑部邮箱 ,2006年02期

【分类号】TG456.3
【下载频次】45

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