【摘要】 采用激光Doppler非接触测试方法,提取芯片封装引线键合工艺的关键部件——劈刀末端的超声振动信号。利用时频联合分析方法将劈刀末端振动信号拓展到时频域分析。结果表明,相比于单纯的时域或频域分析,时频联合分析更清楚地描述键合过程劈刀末端振动在时频域的动态变化特性,包括谐波成分、频率漂移、能量变化等丰富的信息,有助于深入理解键合点的形成过程。而且,时频分析可作为键合成功或失败的一种识别方法。更多还原

【Abstract】 With laser Doppler non-contact measurement, vibration signal of capillary tip is picked up and analyzed by joint time-frequency analysis. The results show that, comparing to pure time or frequency domain analysis, joint time-frequency analysis can illustrate the dynamic vibration characteristics of capillary tip more clearly, including harmonic components, frequency shift, and energy change, which help to understand the bonding process of the interface between Al bump and substrate. Moreover, time-frequency analysis can classify success and failure bond.更多还原