【摘要】 通过对可调节介电常数的填充材料、介质厚度均匀性、铜板处理工艺的研究与选择,研制开发出了介电常数为6.15、介质损耗因数为0.0015的铜基高频电路用覆铜板。更多还原

【Abstract】 By studying the filling which can adjust dielectric constant, the equality of dielectric thickness andcopper board preparation technics , have developped high frequency circuit using copper-clad copper base boardwhose dielectric constant is 6.15 and dissipation factor is 0.0015.更多还原