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大规模MCM基板互连探针测试和路径优化

Probe Test Technology and Traversal Optimization for Large-Scale MCM Substrate Interconnections

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【作者】 许川佩; 许君华; 李智; 莫玮;

【Author】 Xu Chuanpei 1,2 Xu Junhua2 Li Zhi2 Mo Wei2 1(School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China) 2(Dept. of Electronic Engineering, guilin University of Electronic Technology, Guilin 541004,China)

【机构】 西安电子科技大学机电工程学院; 桂林电子工业学院电子工程系; 桂林电子工业学院电子工程系 西安710071桂林电子工业学院电子工程系桂林541004; 桂林541004;

【摘要】 已有的路径优化算法在MCM基板互连测试中已经发挥了一定的作用,但由于MCM的高密互连特性,使得测试变得更加复杂和困难,因此人们希望能引入新的方法与思路,以解决MCM基板互连测试的路径优化问题。将蚁群算法应用到互连测试探针路径优化问题当中,根据MCM基板互连测试的特点,建立探针路径优化的模型。提出一种针对大规模MCM基板互连探针测试的方法,首先将MCM基板进行分片,然后对每片进行优化,最后将优化结果连接在一起,成为一条完整的路径。实验结果表明,蚁群算法能在较短的时间内得到更优的路径。

【Abstract】 Previous traversal optimization algorithms have made contribution to probe test for MCM substrate interconnections. Due to the high density interconnections in MCM, testing becomes increasing complex and difficult for MCM to ensure its reliability and good performance. Therefore, new probe testing methodologies should be considered to solve the probe traversal optimization problem of MCM interconnection test. According to the characteristics of MCM substrate interconnection test, the ant colony system algorithm is applied to the probe traversal optimization problem and a probe traversal optimization model is generated. Further a new method of probe test is presented for large-scale MCM substrate interconnections. The method divides MCM substrate into several parts, optimizes every part and connects all optimization results to one integrity traversal. Experimental results show that the algorithm can achieve better traversal in a short amount of time.

【基金】 国家自然科学基金(60266001)资助项目。
  • 【文献出处】 仪器仪表学报 ,Chinese Journal of Scientific Instrument , 编辑部邮箱 ,2006年01期
  • 【分类号】TN405.97
  • 【被引频次】1
  • 【下载频次】111
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