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含传感器脱粘损伤的智能结构响应特性分析
Analysis of the Characteristic Response of Smart Structures whit Transducer Debonding
【摘要】 采用HHT方法对表面粘贴了压电传感器的复合材料悬臂梁进行模态时频域分析,得到结构响应瞬时频率和Hilbert谱,分析了压电片与复合材料基体间不同程度的局部脱胶对结构动态特性的影响。作为比较,还给出了结构试验模态分析和有限元分析结果。研究结果表明,传感器局部开胶对结构的瞬时频率和模态频率等均有明显的影响。与传统方法相比,HHT分析的结果准确稳定,变化趋势清晰,且具有明显的物理含义。
【Abstract】 An modal analysis in time-frequency domain was performed on the composite laminated cantilever beams with surface bonded piezoelectric ceramic patches using HHT method in this paper.The instantaneous frequencies and Hilbert spectrums of the structures have been obtained to analyze the response characteristic of the structures with varying degree transducers debonding.As a comparison,the results of conventional modal analysis and finite element numerical analysis on the specimens were also given.The research results show that transducer with partially debonding results in clear change of instantaneous frequencies and modality frequencies of the structures.HHT is more effective than conventional methods and can give a more clear physically meaningful interpretation to the structure response.
【Key words】 HHT; modal analysis; smart structure; piezoelectric transducer; debonding damage;
- 【文献出处】 压电与声光 ,Piezoelectrics & Acoustooptics , 编辑部邮箱 ,2006年05期
- 【分类号】TP212
- 【被引频次】1
- 【下载频次】98