【摘要】 针对集成传感器芯片封装粘贴过程中的残余应力影响器件性能的问题,使用有限元方法对环氧粘胶粘贴集成传感器芯片产生的封装残余应力进行了分析.采用有机层压板作为封装基板,仿真计算了环氧粘胶的杨氏模量、厚度和溢出厚度的变化对集成传感器性能的影响,同时对集成传感器进行了封装实验.实验测量与仿真结果的比较分析表明:通过选择低杨氏模量的环氧粘胶、增加环氧粘胶厚度和增加环氧粘胶的溢出厚度可以减小封装应力对集成传感器的影响,而且封装应力对其中压力传感器的影响远大于对温度和湿度传感器的影响.分析结果对集成传感器的封装应用具有一定的参考价值.更多还原

【Abstract】 To investigate the sensor packaging effect,the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates.The variability of the residual stress is investigated by changing the adhesive with different Young’s modulus,the thickness and fillet height parameters.The experiment of the monolithic multi-sensor package is performed.The simulatied results are compared with the experimental ones.The results show that the package-induced residual stress can be reduced by decreasing the Young’s modulus of the adhesive,increasing the thickness and fillet height of the adhesive.更多还原