节点文献
基于UV-LIGA技术的微注塑金属模具的工艺研究
Study on Process of Microinjection Metal Mold Based on UV-LIGA Technology
【摘要】 介绍了一种新颖的微注塑模具的制作方法———无背板生长法,它是利用负性厚SU-8光刻胶,通过低成本的UV-LIGA表面微加工工艺,直接在金属基板上电铸镍图形而制作完成的。讨论了SU-8胶与基底的结合特性以及几种去除SU-8胶的有效方法,所制作的微注塑模具已用于微注塑加工中。无背板生长工艺的突出优点是微电铸时间短、模具质量高,而且还适合于制作其他微机械组件,是目前MEMS领域中比较有发展前途的加工方法。
【Abstract】 A novel microfabrication technology of microinjection metal mold is presented,which it is called no-back-plate-growth method.By the method,the nickel micro-electroforming pattern was directly made on a metal substrate by a low-cost UV-LIGA surface micro-fabrication process using the negative thick SU-8 photoresist to form the microinjection mold.The adhesion property of the photoresist with the substrate and some effective methods of removing the photoresist were discussed.The method takes a short time for micro-electroforming and produces high quality of mold,and it is also adapted to fabricate other micro-mechanical components.So,it is a kind of processing technique with a development prospect in the MEMS field.
【Key words】 micro electroforming; UV-LIGA process; SU-8 photoresist; microinjection mold;
- 【文献出处】 微细加工技术 ,Microfabrication Technology , 编辑部邮箱 ,2006年05期
- 【分类号】TN405
- 【被引频次】21
- 【下载频次】492