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锡镍铜三元合金电镀新工艺的研究
Study on Tin-nickel-copper Alloy Electrodeposition
【摘要】 研究了一种柠檬酸盐体系电镀锡镍铜合金新工艺。讨论了络合剂的浓度、电流密度、铜离子的浓度、pH、温度等因素对锡镍铜合金镀层的外观及铜、镍的含量的影响。实验结果表明:该工艺所得镀层表面细致、均匀,抗变色性好,耐腐蚀性强。
【Abstract】 A new technology that the tin-nickel-copper alloy deposition can be electroplated in the citrate acid system bath was introduced.The effect of pH value,current density,temperature and the concentration of the main salt and copper ion in the bath on composition of the coating were studied.The experimental results showed that under this operate conditions,the obtained layer surface was even,meticulous,high corrosion-resitant and was not easily changed color.
【关键词】 Sn-Ni-Cu合金;
电镀;
柠檬酸盐体系;
【Key words】 tin-nickel-copper alloy; electrodeposition; citrate acid system;
【Key words】 tin-nickel-copper alloy; electrodeposition; citrate acid system;
- 【文献出处】 当代化工 ,Contemporary Chemical Industry , 编辑部邮箱 ,2006年06期
- 【分类号】TQ153.2
- 【被引频次】7
- 【下载频次】409