【摘要】 微电子系统中互连尺寸的微细化使构成焊点的钎料合金的力学性能成为影响电子封装与组装产品可靠性的关键因素。因此,在微米及纳米尺度深刻掌握Sn基钎料合金的断裂行为对于更好地预测焊点可靠性具有重要意义。本文针对100Sn、63Sn37Pb、96.5Sn3.5Ag三种Sn及Sn合金,在进行力学性能测试和显微组织分析的基础上,考察了Sn及Sn合金在微米尺度上的动态断裂机制,以及纳米尺度上裂纹尖端的真实物理过程,阐述了Sn基体、含铅Sn合金和无铅Sn合金三者互有关联又各有不同的微观断裂行为特征。更多还原

【Abstract】 The interconnection structure size in the micro electronic system has been reduced to a finer level,which drive the mechanical properties of solder alloys that making of the solder joint to be the key factor to influence the reliability of electronic packaging and assembly products.As a consequence,it is very important to understand the fracture behavior of such alloys that will allow one to predict the reliability of solder joints better in electronic interconnections.In this paper,based on the mechanical properties testing and the microstructure analysis,the dynamic fracture mechanisms of 100Sn,63Sn37Pb,and 96.5Sn3.5Ag are studied in micro scale and the actual physical process ahead of the crack tip were inspected.Then,the correlative but dissimilar micro fracture characteristics among the Sn matrix,the lead-containing Sn-based alloy,and the lead-free Sn-based alloy were analyzed thoroughly.更多还原