【摘要】 通过试验,选用较佳的热压烧结和冷压烧结工艺制得铜基电接触材料,分析对比了其微观组织与性能。用真空热压烧结工艺制得铜基电接触材料电阻率可达2．45μΩ·cm,硬度达57．4HB,相对密度可达90%以上。更多还原

【Abstract】 Copper-based electric contact materials were prepared by the hot-pressed sintering and cold-pressed sintering technology.The microstructure and its various properties were also discussed.The resistivity,hardness and relative density of the materials by hot-pressed technology is 2.45μΩ·cm.57.4HBand 90%,respectively.更多还原